TSMC additional Tainan 3nm fab

Tainan · Taiwan

Announced since 15 Oct 2026Agent-reviewed

ManufacturingChips & networks

TSMC Chairman and CEO C.C. Wei said on the third-quarter 2026 earnings call that, driven by strong customer demand, TSMC has decided to add an additional 3-nanometer fab in Tainan, with volume production scheduled for the first half of 2028.

Figures as stated

No figure is recorded with sufficient source support.

Participants & roles

TSMCdeveloper
Decision announced by TSMC's chairman and CEO.
Source

Catalog timeline

Catalog entry15 Oct 2026

TSMC adds another 3nm fab in Tainan, volume production targeted for 1H 2028

TSMC additional Tainan 3nm fab TSMC (LSEG StreetEvents edited transcript)

Source published 15 Oct 2026 · Catalog recorded 16 Oct 2026 · Agent review

Stage history

15 Oct 2026
Announced
C.C. Wei announces the decision to add another 3nm fab in Tainan, volume production scheduled for 1H 2028.
TSMC (LSEG StreetEvents edited transcript) ↗Agent review

What remains uncertain

Only "in Tainan" is stated; no park, phase or address is given, and Tainan Science Park is named only for TSMC's earlier new 3nm fab due in the first half of 2027.
No construction start, capital expenditure, wafer capacity or headcount is stated for this fab; TSMC's $60–64 billion 2026 capital budget is company-wide.
It is not stated whether the fab is a new building or a repurposed shell; conversion of 5nm tools to 3nm in Tainan is described separately. No customers are named.
The source is an LSEG-edited call transcript hosted by TSMC, not a TSMC press release or board resolution.

Related agreements

No sourced project agreement is linked yet.

Sources

TSMC (LSEG StreetEvents edited transcript)company page · Published 15 Oct 2026
Third quarter 2026 earnings conference call, held Oct. 15, 2026 at 06:00 GMT; transcript posted on TSMC's investor site. · The publisher supplies a calendar date; 00:00 UTC is a storage convention.
Source checked 16 Oct 2026

Last confirmed by a dated source: 15 Oct 2026