Companiespublic

Micron

MUAgent-reviewed

Manufacturing

Memory manufacturer expanding AI-related wafer and packaging capacity.

Official site ↗ · On AlphAI ↗

Project footprint 6

Boise ID1 fab
developer
Under construction
Micron Clay first fab
developer
Under construction
Micron Hiroshima cleanroom expansion
developer
Under construction
Singapore HBM packaging
developer
Under construction
Singapore NAND wafer fab
developer
Under construction
Micron Tongluo conversion
developer
Announced

Agreement footprint 0

No sourced agreement is linked yet.

Recent catalog updates

Catalog entry · Agent review16 Mar 2026

Micron Tongluo conversion

After completing its Tongluo P5 acquisition, Micron plans to retrofit the existing cleanroom for advanced DRAM and HBM. Meaningful shipments are expected in fiscal 2028.

Micron Tongluo conversion Micron

Catalog entry · Agent review26 Jan 2026

Singapore NAND wafer fab

Micron broke ground on a NAND wafer fab for AI-driven memory and storage demand.

Singapore NAND wafer fab Micron

Catalog entry · Agent review26 Jan 2026

Singapore HBM packaging

Micron’s HBM packaging facility remains on its expansion roadmap; the latest update targets meaningful capacity contribution in 2027.

Singapore HBM packaging Micron

Catalog entry · Agent review04 Jul 2026

Micron Hiroshima cleanroom expansion

Micron broke ground on a phased cleanroom expansion for advanced DRAM and HBM supporting AI demand; equipment installation is planned for late 2028.

Micron Hiroshima cleanroom expansion Micron

Catalog entry · Agent review09 Jul 2026

Micron Clay first fab

Micron reports its first concrete pour at Clay, moving its first New York memory fab from site preparation into vertical construction.

Micron Clay first fab Micron

Catalog entry · Agent review09 Jul 2026

Boise ID1 fab

Micron reports progress at its first Idaho memory fab, with first wafer output expected in mid-2027.

Boise ID1 fab Micron